dip sockets molded dip sockets closed frame and open frame 5 energy w ay , w est w arwick, ri 02893 usa t el: 800.424.9850 | 401.823.5200 fax: 401.823.8723info@advanced.com | www .advanced.com cat alog 16a products shown covered by patents issued and/or pending. specifications subject to change without notice. inch/(mm) table of models description: closed frame socket (rds) mat?l: high t emp. liquid cryst al polymer (lcp) index: -40c to 260c (-40f to 500f) description: open frame socket (rls) mat?l: high t emp. liquid cryst al polymer (lcp)index: -40c to 260c (-40f to 500f) .050 (1.27) .125 (3.18) how to order rds 3 16 - 01 m g contact plating terminal plating terminal type body type rohs compliant: rds - hi-temp lcp closed frame molded rls - hi-temp lcp open frame molded number of pins closed frame 8 - 40open frame 8 - 64 (see table on next page for standard pin counts) see options on next page rohs compliant: g - goldm - matte tin t - tin/lead rohs compliant: g - goldt - tin/lead dip spacing 3 - .300/(7.62mm)4 - .400/(10.16mm) 6 - .600/(15.24mm) 9 - .900/(22.86mm)* *open frame only description: peel-a-w ay ? socket (ks) material: polyimide filmindex: -269c to 400c (-452f to 752f) for more information, refer to the peel-a-w ay ? dip socket s p ages (30-31). polyimide film .005(.13) rds replaces ds and hds.rls replaces ls and hls. options tape seal - add 3m to end of part number ? removable t ape seal protect s plated cont act in harsh environment s ? sealed socket will not allow dirt and other cont aminant s to enter socket chamber and become entrapped behind cont act fingers ? s pray flux without cont aminating cont act area note: t erminals plated with matte t in are available only with gold plated cont act s. specifications: terminals: brass - copper alloy(c36000) astm-b-16 contacts: ber yllium copper - copper alloy (c17200) astm-b-194 solder preform: standard: 63sn/37pblead-free: 95.5sn/4.0ag/0.5cu plating: g - gold over nickelm - matte t in over nickel t - t in/lead over nickel gold per astm-b-488matte t in per astm545-97 t in/lead per mil-p-81728 nickel per qq-n-290 features: ? multiple finger contact on allsockets assures maximum reliability . ? t apered entr y for ease of insertion. ? closed bottom sleeve for 100%anti-wicking of solder . ? t o fit .100/(2.54mm) pitch. ? easily customized to fit yourapplication. material silicone backed polyimide film, -74c to 260c (-100f to 500f) intermittent to 371c (700f) * * .100/(2.54) for 48 and 60 pos.
molded dip sockets closed frame and open frame dip sockets 5 energy w ay , w est w arwick, ri 02893 usa t el: 800.424.9850 | 401.823.5200 fax: 401.823.8723info@advanced.com | www .advanced.com cat alog 16a products shown covered by patents issued and/or pending. specifications subject to change without notice. inch/(mm) 22 .400 (10.16) .500 (12.70) 1.100 (27.54) 24 .400 (10.16) .500 (12.70) 1.200 (30.48) 24 .600 (15.24) .700 (17.78) 1.200 (30.48) 28 .600 (15.24) .700 (17.78) 1.400 (35.56) 32 .600 (15.24) .700 (17.78) 1.600 (40.64) 40 .600 (15.24) .700 (17.78) 2.000 (50.80) 48* .600 (15.24) .700 (17.78) 2.400 (60.96) 64* .900 (22.86) 1.000 (25.40) 3.200 (81.28) 8 .300 (7.62) .400 (10.16) .400 (10.16) 14 .300 (7.62) .400 (10.16) .700 (17.78) 16 .300 (7.62) .400 (10.16) .800 (20.32) 18 .300 (7.62) .400 (10.16) .900 (22.86) 20 .300 (7.62) .400 (10.16) 1.000 (25.40) 22 .300 (7.62) .400 (10.16) 1.100 (27.94) 24 .300 (7.62) .400 (10.16) 1.200 (30.48) 28 .300 (7.62) .400 (10.16) 1.400 (35.56) .165 (4.19) .275 (6.99) .020 dia. (.51) standard terminals type -01 type -29 type -30 type -51 low profile solder t ail .165 (4.19) .125 (3.18) .020 dia. (.51) .165 (4.19) .170 (4.32) .020 dia. (.51) .130 (3.30) .110 (2.79) .020 dia. (.51) low profile solder t ail low profile solder t ail low profile solder t ail type -04 type -49 .120 (3.05) .110 (2.79) .028 dia. (.71) .095 (2.41) .095 (2.41) .028 dia. (.71) solder preform terminals .072 dia. (1.83) .020 dia. (.51) .110 (2.79) .130 (3.30) solder preform .072 dia. (1.83) .165 (4.19) .125 (3.18) .020 dia. (.51) solder preform tin/lead: type -150 lead-free: type -811 tin/lead: type -151 lead-free: type -812 type -237 .052 dia. (1.32) .155 (3.94) dimensional information b c a .125 (3.18) c a .050* (1.27) b rds closed frame rls open frame # of pins a b c intrusive reflow application: ? combines the labor of socketloading and solder application into one operation. ? eliminates the use of solder pasteand screening operation. ? eliminates solder bridges and/orsolder shorts due to excess solder . ? ensures a reliable solder joint withcontrolled solder volume. ? ideal for sur face mount and mixed technology applications. ? for custom solder preformterminal applications consult factor y. # of pins a b c the dimensions in blue are for open frame only . *socket body thickness is .100/(2.54) for 48 and 64 positions. ultra low profile not for use with closed frame super low profile not for use with closed frame surface mount additional standard and custom terminals available.see t erminals section or consult factor y. available online: ? rohs qualification t est report ? cad drawings before reflow after reflow solder preform plated thru hole (pth) pcb pcb = express in rls express deliveryt erminals shown with the new express symbol are available in most insulatorbody types with fast lead time. some quantity and plating restrictions apply . sear ch our distributor inventor y online at www .advanced.com, or check with customer ser vice for availability .
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